| 高温压力传感器固态隔离封装技术的研究 |
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| 引用本文： | 张生才,姚素英,刘艳艳,赵毅强,张为.高温压力传感器固态隔离封装技术的研究[J].电子科技大学学报(社会科学版),2002(2). |
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| 作者姓名： | 张生才 姚素英 刘艳艳 赵毅强 张为 |
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| 作者单位： | 天津大学电子信息工程学院 天津300072
(张生才，姚素英，刘艳艳，赵毅强)，天津大学电子信息工程学院 天津300072(张为) |
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| 基金项目： | 国家自然科学基金资助项目编号:69876207 |
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| 摘 要： | 论述了多晶硅高温压力传感器小型化固态隔离封装技术、静电键合技术、不锈钢膜片的选择及波纹设计技术、激光焊接技术、硅油充灌和硅油隔离技术等。以不锈钢膜片和高温硅油为隔离材料,使传感器的封装直径缩小到15 mm,在1 mA电流激励下传感器满量程输出为72 mV,零点稳定性为0.48%F.S/mon,提高了传感器的可靠性,拓宽了传感器的应用领域。
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| 关 键 词： | 高温 压力传感器 静电键合 固态隔离 封装 硅油充灌 |
Research on Isolated Solid-state Encapsulation Technology of High-temperature Pressure Sensor |
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| Zhang Shengcai,Yao Suying,Liu Yanyan,Zhao Yiqiang,Zhang Wei.Research on Isolated Solid-state Encapsulation Technology of High-temperature Pressure Sensor[J].Journal of University of Electronic Science and Technology of China(Social Sciences Edition),2002(2). |
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| Authors: | Zhang Shengcai Yao Suying Liu Yanyan Zhao Yiqiang Zhang Wei |
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| Abstract: | This paper mainly discusses miniature isolated solid-state encapsulation technology of high-temperature polysilicon pressure sensor, including static electricity bonding ,stainless steel diaphragm selection and rippled design,laser welding,silicon oil infilling, isolation and other technologies used in sensor packaging. By adopting stainless steel diaphragm and high-temperature silicon oil as isolation materials, not only the encapsulation diameter of sensor is as small as 15 mm and under 1 mA drive,its full range output is 72 mV and zero stability is 0.48%F.S/mon ,but also the reliability of the sensor is improved and its application is widely broadened. |
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| Keywords: | high-temperature pressure sensor static electricity bonding isolated solid-state encapsulation silicon oil infilling |
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