| LTCC多层互连基板工艺及优化 |
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| 引用本文： | 王浩勤,曾志毅,尉旭波,徐自强. LTCC多层互连基板工艺及优化[J]. 电子科技大学学报(社会科学版), 2008, 0(Z1) |
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| 作者姓名： | 王浩勤 曾志毅 尉旭波 徐自强 |
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| 作者单位： | 电子科技大学电子科学技术研究院;电子科技大学电子科学技术研究院 成都; |
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| 摘 要： | 低温共烧陶瓷(LTCC)多层互连基板,具有可内埋无源元件、高频特性优良、IC封装基板、小型化等优点,在军事、宇航、汽车、微波与射频通信等领域得到了广泛应用,其制造技术,是MCM技术中的关键技术。该文介绍了LTCC基板的制造工艺、关键技术及其优化。通过对关键工艺进行优化,获得了一套适合带腔体LTCC多层互连基板制作的工艺参数。并已成功研制出满足T/R组件微波电路性能要求的LTCC多层互连基板。
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| 关 键 词： | 互连电路 低温共烧陶瓷 多层 工艺优化 通孔填充 |
Optimization of LTCC Multilayer Interconnect Substrate Process |
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| WANG Hao-qin,ZENG Zhi-yi,WEI Xu-bo,, XU Zi-qiang. Optimization of LTCC Multilayer Interconnect Substrate Process[J]. Journal of University of Electronic Science and Technology of China(Social Sciences Edition), 2008, 0(Z1) |
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| Authors: | WANG Hao-qin ZENG Zhi-yi WEI Xu-bo XU Zi-qiang |
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| Affiliation: | WANG Hao-qin,ZENG Zhi-yi,WEI Xu-bo,, XU Zi-qiang (Research Institutes of Electronic Science , Technology,University of Electronic Science , Technology of China Chengdu 610054) |
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| Abstract: | Low temperature cofired ceramic (LTCC) possesses a great number of advantages. It is used as IC substrate plate where passive devices may be embedded. LTCC is widely used in military, astronavigation, automobile, microwave and radio frequency communication. This paper deals with the manufacture and the process optimization of LTCC. |
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| Keywords: | interconnection circuit low temperature co-fired ceramic multilayer process optimization via filling |
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