| 化学镀金镀速的研究 |
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| 引用本文： | 迟兰洲,胡文成,张茂斌.化学镀金镀速的研究[J].电子科技大学学报(社会科学版),1994(4). |
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| 作者姓名： | 迟兰洲 胡文成 张茂斌 |
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| 作者单位： | 电子科技大学应用化学系 |
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| 摘 要： | 研究了以硼氢化物作为还原剂的化学镀金溶液，通过正交实验得出了主盐、还原剂、络合剂、ｐＨ值和温度对镀速影响的关系，对正文实验结果进行线性回归，得出了化学镀金动力学经验方程，并得出最佳配方及工艺条件。
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| 关 键 词： | 化学镀金，硼氢化，镀速，正交实验，经验方程 |
STUDY ON PLATING RATE IN ELECTROLESS GOLD DEPOSITION |
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| Chi Lanzhou, Hu Wencheng, Zhang Maobing.STUDY ON PLATING RATE IN ELECTROLESS GOLD DEPOSITION[J].Journal of University of Electronic Science and Technology of China(Social Sciences Edition),1994(4). |
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| Authors: | Chi Lanzhou Hu Wencheng Zhang Maobing |
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| Abstract: | Electroless gold plating baths using borohydride as reducing agent are studied.The relations between gold complex ions, reducing agent, Chelating, pH , temperatureand plating rate by orthonogal experiment are developed. The empirical rate equaiton and optimal conditions are obtained. |
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| Keywords: | electroless gold plating borohydride plating rate orthonogal experiment empirical rate equation |
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