| 在电子行业应用电镀技术的现状和展望 |
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| 引用本文： | 林中进,朱有兰. 在电子行业应用电镀技术的现状和展望[J]. 广东工业大学学报(社会科学版), 2003, 3(Z1): 183-185 |
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| 作者姓名： | 林中进 朱有兰 |
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| 作者单位： | 广东工业大学材料与能源学院,广东,广州,510643 |
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| 摘 要： | 对应用在电子行业中的合金电镀和复合技术的现状作了简要的综述,并分析电镀技术变革的主要原因,以及对新世纪里在电子行业中电镀新技术的需求和展望进行了论述.
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| 关 键 词： | 合金电镀 复合电镀 纳米材料 |
| 修稿时间： | 2003-05-13 |
The Present Situation and Prospect of Electroplating Technology in the Field of Electronic Industry |
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| LIN Zhong-jin,ZHU You-lan. The Present Situation and Prospect of Electroplating Technology in the Field of Electronic Industry[J]. Journal of Guangdong University of Technology(Social Sciences Edition), 2003, 3(Z1): 183-185 |
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| Authors: | LIN Zhong-jin ZHU You-lan |
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| Abstract: | In this paper, the present situation of electroplating technology in the field of electronic industry is summarized. And the author discusses the reasons of the reform as well as analyses the requirement of the technology in the 21st century. |
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| Keywords: | alloy plating composite plating nano material |
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